The LM current-feedback amplifier offers an unparalleled combination of bandwidth, slew-rate, and Details, datasheet, quote on part number: LM LM datasheet, LM circuit, LM data sheet: NSC – mA, MHz Current Feedback Amplifier,alldatasheet, datasheet, Datasheet search site for. Download TI technical document LM mA, MHz Current Feedback Amplifier datasheet (Rev. C).
|Published (Last):||26 March 2004|
|PDF File Size:||12.10 Mb|
|ePub File Size:||20.11 Mb|
|Price:||Free* [*Free Regsitration Required]|
Documents Flashcards Grammar checker. This represents a radical enhancement in output drive capability for an 8-pin PDIP high-speed amplifier making it ideal for video applications. Pin Configuration and Functions Page numbers for previous revisions may differ from page dtaasheet in the current version. Added, updated, or renamed the following sections: Updated selected plots for readability. Operating ratings indicate conditions the device is intended to be functional, but device parameter specifications may not be ensured under these conditions.
For ensured specifications and test conditions, see the Electrical Characteristics. Human body model pF and 1. Boldface limits apply at the temperature extremes. All limits ensured at room temperature standard type face or at operating temperature extremes bold face type.
Input Voltage Noise vs Frequency Figure Input Current Noise vs Frequency Figure Offset Voltage vs temperature Figure Offset Voltage vs Temperature Figure Transimpedance vs Temperature Figure Quiescent Current vs Temperature Figure Dayasheet Bias Current vs Temperature Figure Absolute Maximum Power Derating: SOIC package Figure In contrast, the current feedback amplifier topology, such as the LM, transcends this limitation to offer a signal bandwidth that is relatively independent of the closed-loop gain.
100 MA, 100 MHz Current Feedback Amplifier
Therefore, RS and not Rf, must be varied to adjust for the lmm6181 closed-loop gain as in Figure It is critical to maintain a wideband low-impedance to ground at the amplifiers supply pins to insure the fidelity of high speed amplifier transient signals. Catasheet bypass capacitors should be placed as close to the amplifier pins as possible 0. Rf Selecting the feedback resistor, Rf, is a dominant factor in compensating the LM Although this value will provide good results for most applications, it may be advantageous to adjust this value slightly.
Figure 79 and Figure 80 illustrate the effect of increasing Rf while maintaining the same closed-loop gain—the amplifier bandwidth decreases. Rf continued VOUT 0. In voltage feedback amplifiers slew rate limiting or non-linear amplifier behavior is dominated by the finite availability of the 1st stage tail current charging the lm1681 capacitor.
LM 데이터시트(PDF) – National Semiconductor (TI)
The slew rate of current feedback amplifiers, in contrast, is not constant. Transient current at the inverting input determines slew rate for both inverting and non-inverting gains. The non-inverting configuration slew rate is also determined by input stage limitations.
Accordingly, variations of slew rates occur for different circuit topologies. Although the LM can directly drive as much as pF without oscillating, the resulting response will be a function of the feedback resistor value. Figure 83 illustrates the small-signal pulse response of the LM while driving a 50 pF load.
Ringing persists for approximately 70 ns. Either technique, however, results in lowering the system bandwidth. This compensation datashete to reduce the amplifier’s peaking in the frequency domain which equivalently tames the transient response.
To limit the bandwidth of current feedback amplifiers, do not use a capacitor across Rf. The dynamic datasheey of capacitors in the feedback loop reduces the amplifier’s stability. Instead, reduced peaking in the frequency response, and bandwidth limiting can be accomplished by adding an RC circuit, as illustrated in Figure Customers should validate and test their design implementation to confirm system functionality.
The typical recovery times for open-loop, closed-loop, and input common-mode voltage range overdrive conditions are illustrated in Figure 90, Figure 92, and Figure 93, respectively. Typical positive and negative overdrive recovery times shown in Figure 90 are 5 ns and 25 ns, respectively.
Figure 92 displays the typical 30 ns recovery time to a linear output value. All other trademarks are the property of their respective owners. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Datashest glossary lists and explains terms, acronyms, and definitions. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document.
For browser-based versions of this data sheet, refer to the left-hand navigation. Product device recommended for new designs. TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. Device has been announced but is not in production. Samples may or may not be available.
TI has discontinued the production of the device. TI’s terms “Lead-Free” or “Pb-Free” mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe.
If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Finish options are separated by a vertical ruled line.
The information provided on this page represents TI’s knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third datazheet, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI’s liability arising out of such information exceed the total purchase price of the TI part s at issue in this document sold by TI to Customer on an annual basis.
Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. Buyers are responsible for their products and applications using TI components. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating datasheft any combination, machine, or process in which TI components or services are used.
Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices.
TI is not responsible or liable for such altered documentation. Information of datashheet parties may be subject to additional restrictions. Resale of TI components or services with lm681 different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or dataxheet and is an unfair and deceptive business practice.
TI is not responsible or liable for dataheet such statements. Buyer acknowledges and agrees dxtasheet it is solely responsible for compliance with all legal, regulatory and dtaasheet requirements concerning its products, and any use of TI components in catasheet applications, notwithstanding any applications-related information or support that may be provided by TI.
Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions.
Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications.
Nonetheless, such components are subject to these terms. Pm6181 TI components are authorized for use in FDA Class III or similar life-critical medical equipment unless authorized officers lk6181 the parties have executed a special agreement specifically governing such use. Buyer datwsheet and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer’s risk, and that Buyer lm61881 solely responsible for compliance with all legal and regulatory requirements in connection with such use.
Products Applications Audio www. The Four Functions of the Computer. In this folder, I will soon create a folder for Please try to update June 30, Name Address.